Máquina de marcado láser UV

Equipment Introduction

Ultraviolet laser marking machine belongs to the series of laser marking machines. It incorporates advanced laser technology. High-energy ultraviolet photons directly destroy the molecular bonds on the surface of many non-metallic materials, so that the molecules are separated from the object. This method does not generate high heat. The ultraviolet laser spot is extremely small, and the processing is almost not damaged by heat, so it is called cold processing. The ultraviolet laser marking machine is developed using a 355nm ultraviolet laser. The machine uses third-order cavity frequency doubling technology compared with infrared laser. El 355 ultraviolet light has a very small focused spot, which can greatly reduce the mechanical deformation of the material and Processing heat effect is small. Because it is mainly used for ultra-fine marking and engraving. It is especially suitable for marking and perforating food, PCB circuit boards, electronic components and medical packaging materials. High-speed division of glass materials and complex graphic cutting of silicon wafers and other fields!

Características

1. The ultraviolet laser has a very small focusing spot and a small processing heat affected area, so it can perform ultra-fine marking, which is the first choice for customers who have higher requirements for marking effects;
2. In addition to the copper material, the ultraviolet laser can process a wider range of materials;
3. Not only the beam quality is good, but the focus spot is smaller, and ultra-fine marking can be achieved;
4. The scope of application is more extensive; the heat affected area is extremely small, there will be no thermal effect, and there will be no problem of material scorching;
5. The marking speed is fast and the efficiency is high; the whole machine has stable performance, small size, low power consumption and other advantages;

Device parameters

Device application

1. Suitable for marking and micro-hole processing on the surface of glass, polymer materials and other objects;
2. Widely used for marking the surface of packaging bottles (boxes) of polymer materials such as food, medicamento, cosmetics, wires, etc. .;
3. Flexible PCB board, LCD, TFT marking, dicing cutting, etc. .;
4. Metal or non-metallic coating removal;
5. Micro-hole and blind hole processing of silicon wafer;